Introduction

This components platform is the silicon platform from ST-F. ST offers an access to application-specific standard and custom devices and to their leading-edge silicon processes and package technologies for customer-designed products to give added performance and value to the end product. Several technologies including advanced 65nm and 28nm CMOS will be available for SME. Only architecture exploration and Device definition will be funded in the EuroCPS project. The R&D for designing new components will be covered by other kind of funding (SME programs and ECSEL).